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Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
This is a device that picks up diced devices attached to a wafer one by one, undergoes visual inspection (image processing), and tapes the good products onto an embossed tape.
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
The "MAG-PT" is a pick-and-taping device that excels in customization to meet customer needs, including support for special unit attachments. With a pickup technology of 10 pieces per second, it quickly extracts chips from wafering and packages them into embossed tape. Additionally, motion control reduces dynamic load. For chip positioning, image recognition is utilized, ensuring accurate packaging of even the smallest chips through θ-direction correction on the horizontal transport chuck and position correction of the embossed tape. It also offers a variety of optional features, including mapping functionality and image processing capabilities (for cracks, chips, and foreign material contamination). 【Features】 ■ High-speed pickup technology ■ Reduction of dynamic load through motion control ■ Non-contact, damage-free positioning of components ■ Reliable packaging of ultra-small chips ■ Time-saving technology for product changeover *For more details, please refer to the PDF document or feel free to contact us.
